A Different Kind of Electronic Packaging Solutions Company |
Pixus Technologies a leading designer and manufacturer of high-performance chassis platforms, backplanes, and related accessories for the embedded computed market. This includes MIL rugged and commercial grade designs, primarily focused on Modular Open Standard Architectures, including but not limited to SOSA aligned, VITA and PICMG-based open standards. The company also develops specialty ruggedized enclosure systems and modular instrumentation cases, subracks, and components. |
Commitment to Innovation and Design |
Pixus Technologies is the "embedded computing group" of Rittal, the largest manufacturer of enclosures in the world. Pixus was founded by former Kaparel/Rittal management, with the design leadership team that developed cutting-edge COTS open standard architecture solutions since the 1990's. The Pixus/Rittal team is able to offer time-tested embedded computing system platforms and electronics enclosures at competitive prices. We leverage the Rittal brand mechanical designs with over 100K components and hundreds of proven enclosure designs to PICMG and VITA open-standard specification for over 30 years. Pixus also provides unsurpassed thermal management solutions, creative design innovations, backplane design and subsystem integration expertise. This powerful combination results in the premier value in the industry for electronics packaging. |
Service Offerings
Front Panel Customization & Assemblies: Front panels require precision design and manufacturing to ensure optimal performance, reliability, and EMC protection. Services for the front panels include custom design, stamping/milling, painting/silkscreening, assembly and single part number ordering. Contact Pixus for custom handle/panel services. | Modified Standards & Customization: Pixus Technologies' focus allows their customers to supply the application while they provide a reliable architecture solution on time. One of their main tasks is to develop and test individual parts, then supply these fully assembled and tested in any required configuration and quantity. |
Thermal Simulation: Using thermal analysis software and test equipment, Pixus is able to provide thermal management analysis of the enclosures. We can perform "what if...?" simulations to determine the best course of action in providing adequate cooling while balancing your EMC, acoustic noise, mechanical, and cost-basis requirements. | Backplane Simulation/Characterization: Pixus Technologies can perform pre-design simulation and post-design characterization testing to confirm superior backplane performance. |
Experts in Their Field |
Pixus Technologies is built upon a foundation of a modular line of embedded system and enclosure products incorporating virtually limitless configurations of components. Â With superior cooling, advanced backplane design, and strong signal integrity, Pixus leverages a wide range of highly successful SOSA aligned, OpenVPX, MicroTCA/ATCA, cPCI Serial, VME, and customized solutions chosen by leading companies worldwide. With a highly experienced team of industry experts, Pixus is taking these solutions to the next generation and is actively involved in the continuous development of leading solutions that surpass all data transfer and cooling challenges. The Pixus instrument cases and embedded solutions serve the energy, communications, military, aerospace, medical, industrial, transportation, and test & measurement industries. |
Your Partner for Success |
The Pixus team is able to offer time-tested embedded computing system platforms and electronics enclosures at competitive prices. They leverage over 30 years of established mechanical designs with over 100K components and hundreds of proven enclosure designs to PICMG and VITA open-standard specification for over 30 years (including design assets acquired from their predecessor company, Kaparel). Pixus also provides unsurpassed thermal management solutions, creative design innovations, backplane design and subsystem integration expertise. This powerful combination results in the premier value in the industry for electronics packaging. Leveraging long-term partnerships established from early origins, they offer: Â
They offer backplane designs, chassis platforms, and board-level products in SOSA aligned, OpenVPX, cPCI Serial (CompactPCI Serial), AdvancedTCA, MicroTCA, and custom architectures. Legacy architectures such as CompactPCI and VME/64x are also available. Pixus offers various rugged enclosures includes ATR, custom, and rugged rackmount designs. Additionally, they provide a vast ecosystem of embedded components including ejector handles & panels, card guides, rails, subracks, instrumentation cases and more.
|
Related Posts
